SMT Assembly
Surface-mount assembly for fine-pitch parts, BGAs and dense layouts.
SMT Assembly with ShinePCB
SMT assembly places components directly on board pads. We review your placement data, paste layer and BOM, prepare a stencil for the design and agree inspection steps with the order.
- Placement data and polarity
- Paste layer and stencil design
- Fine-pitch and BGA parts
- Inspection steps
Capability and certificates
| Positioning | SMT | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| SMT Assembly | Supported | Supported |
Related certificates
Current certificates cover PCB manufacturing only; they do not apply to this service.
Certificate detailsSource: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
SMT capability
| Specification | Standard process | Advanced / non-standard |
|---|---|---|
| Max component height | ≤ 6.5 mm | 6.5 mm < H ≤ 15 mm |
| Max component size | 200 × 125 mm | > 200 × 125 mm |
| Min chip size | 0201 (0.6 × 0.3 mm) | 01005 (0.4 × 0.2 mm) |
| Fine-pitch IC lead pitch | ≥ 0.4 mm | 0.3 mm < pitch < 0.4 mm |
| BGA / CSP ball pitch | ≥ 0.5 mm | 0.3 mm < pitch < 0.5 mm |
Source: ShinePCB SMT capability (process_csv/smt.csv). Advanced / non-standard processes are confirmed per project.
Typical applications
Control boards
Communication modules
Consumer electronics
What to send
Files for an assembly review
- BOM with manufacturer part numbers
- Placement (centroid) file
- Assembly drawing and polarity notes
- Gerber data including paste layers
- Test or programming instructions, if any
Start a project
Share the details you have. Engineering reviews your requirements and raises questions before quotation.
SMT Assembly FAQs
Can you assemble both sides?
Double-sided assembly is reviewed per design.
Which inspections are used?
Inspection steps are agreed with the order during review.
