Blind & Buried Via
Vias that connect only the layers that need them, freeing routing space in complex multilayer boards.
Blind & Buried Via with ShinePCB
Blind vias connect an outer layer to inner layers and buried vias connect inner layers only. We review the drill and lamination sequence with your stack-up and explain the cost impact before quotation.
- Via spans and layer pairs
- Drill and lamination sequence
- Aspect ratio considerations
- Stack-up definition
Capability and certificates
| Positioning | Complex Multilayer | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| Blind & Buried Via | 0.05mm | 0.075mm |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Blind and buried via limits
| Parameter | Prototype | Mass production |
|---|---|---|
| Rigid — Min blind / buried via diameter | 0.05 mm | 0.075 mm |
| Rigid — Min through-hole diameter | 0.075 mm | 0.10 mm |
| Rigid — Max aspect ratio | 35:1 | 30:1 |
| Rigid — Layer registration accuracy | 0.8 mil | 1 mil |
| Rigid-flex — Min laser via diameter | 0.05 mm | 0.05 mm |
| High-frequency / high-speed — Resin-filled via type | Through hole / blind via | Through hole / blind via |
| High-frequency / high-speed — Resin-filled via aspect ratio | 12:1 | 12:1 |
Source: ShinePCB capability workbook. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
Typical applications
Dense multilayer boards
Communication equipment
Compact industrial electronics
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
Blind & Buried Via FAQs
How should I define via spans?
List each via type and the layers it connects in your fabrication drawing or stack-up.
Do blind and buried vias add cost?
They add process steps. We explain the impact during review.
