Back Drilling
Removal of unused via stubs to reduce reflections on fast signals.
Back Drilling with ShinePCB
Back drilling removes the unused portion of plated holes so high-speed channels see shorter stubs. We clarify target layers and stub requirements and review the drill data in DFM.
- Target layers and nets
- Stub requirements
- Drill data and markings
- Interaction with press-fit holes
Capability and certificates
| Positioning | High-Speed Signal Integrity | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| Back Drilling | Supported | Supported |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Related limits
| Parameter | Prototype | Mass production |
|---|---|---|
| Back drilling | Supported | Supported |
| Rigid — Layer count (max) | 48L | 36L |
| Rigid — Max aspect ratio | 35:1 | 30:1 |
| High-frequency / high-speed — Layer count (max) | 24L | 20L |
| High-frequency / high-speed — Min hole spacing | 0.20 mm | 0.25 mm |
| Back-drill stub length | Confirmed per project | Confirmed per project |
Source: ShinePCB capability workbook. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review. A maximum stub value has not been published yet.
Typical applications
High-speed backplanes
Networking line cards
Server and accelerator boards
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
Back Drilling FAQs
How do I specify back drilling?
Identify the nets or holes, the target layers and any stub requirement in your drill data and drawing.
Is back drilling needed for my design?
It depends on data rates and via stubs. Engineering discusses it during review.
