77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Advanced PCB
Advanced PCB Technologies and Materials
Complex interconnects, controlled impedance and specialty laminates for RF, high-speed and high-density designs, confirmed through engineering review for each project.
Advanced technologies
Advanced structures depend on the full design: stack-up, materials, via strategy and test method. We review these together and confirm feasibility before quotation.
Fine line / high density
HDI & Microvia
Microvia and fine-line structures for dense BGA breakout and compact products.
- Via-in-pad and stacked or staggered vias discussed
- Line and space checked in DFM
- Feasibility confirmed per design
Blind & Buried Via
Vias that connect only the layers that need them, freeing routing space in multilayer boards.
- Drill and lamination sequence reviewed
- Via structure confirmed with the stack-up
- Cost impact explained before quotation
Back Drilling
Removal of unused via stubs to reduce reflections on fast signals.
- Target layers and stub requirements clarified
- Drill data reviewed in DFM
- Confirmed per project
Controlled Impedance
Trace geometry and dielectric choices matched to your impedance targets.
- Targets and tolerances clarified
- Geometry proposed with the stack-up
- Test method agreed with the order
Sequential Lamination
Multiple lamination cycles for complex via structures and hybrid constructions.
- Build sequence reviewed with engineering
- Material compatibility checked
- Feasibility confirmed per design
High Layer Count
Complex stack-ups for communication, computing and test equipment.
- Stack-up, thickness and registration reviewed
- Material selected for the application
- Layer count confirmed per project
Selected builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Advanced materials
Material choice affects loss, stability, thermal performance and cost. Supplier datasheet values are material data, not fabrication guarantees; we confirm options and availability for each project.
RF / microwave
Rogers
Rogers laminates for RF and microwave circuits.
- Grade selected with your frequency and loss targets
- Hybrid builds with FR-4 discussed
- Availability checked before quotation
Isola
Isola laminates for high-speed digital and low-loss designs.
- Grade matched to your signal requirements
- Stack-up planned with the material
- Availability checked before quotation
PTFE
PTFE-based materials for demanding RF applications.
- Processing requirements reviewed
- Material options compared with your targets
- Confirmed per project
High-Tg FR-4
FR-4 with a higher glass-transition temperature for designs exposed to heat.
- Laminate chosen for operating and assembly temperatures
- Compatibility with lead-free assembly discussed
- Confirmed with the stack-up
Engineering inputs
Helpful details for advanced designs
- Target frequency, data rate and loss budget
- Impedance targets and tolerances
- Preferred or approved materials
- Via structure and back drilling layers
- Test and inspection requirements
Start an advanced PCB project
Share the details you have. Engineering reviews your requirements and raises questions before quotation.
Advanced PCB FAQs
Can you mix materials in one stack-up?
Hybrid stack-ups are reviewed per project. We confirm compatibility and processing before quotation.
Do you guarantee impedance values?
Impedance targets are reviewed with your stack-up and geometry, and the test method is agreed in the quotation. We do not assume a performance value without project review.
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
