77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Advanced PCB · Advanced Technologies
High Layer Count
Complex high-layer stack-ups for communication, computing and test equipment.
Advanced Technologies
High Layer Count with ShinePCB
High-layer boards need careful stack-up planning, registration and material selection. We review thickness, layer structure and materials, and confirm the layer count for each project.
- Stack-up and total thickness
- Registration and drilling
- Material selection
- Impedance and via strategy
Capability and certificates
| Positioning | Up to 48 Layers | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| High Layer Count | Up to 48L | Up to 48L |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
- CQCCQC20001245054
- IATF 16949:2016NQA T14016 / IATF 0498905
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Layer count by board type
| Parameter | Prototype | Mass production |
|---|---|---|
| Rigid — Layer count (max) | 48L | 36L |
| Rigid — Finished board thickness | 0.2–15.0 mm | 0.3–7.0 mm |
| Rigid — Layer registration accuracy | 0.8 mil | 1 mil |
| Rigid-flex — Layer count (max) | 20L | 18L |
| FPC — Layer count (max) | 12 | 16 |
| High-frequency / high-speed — Layer count (max) | 24L | 20L |
Source: ShinePCB capability workbook. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review. The product line lists multilayer boards from 4 to 48 layers.
Selected builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical applications
Data center and networking hardware
Test and measurement systems
Backplanes
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
High Layer Count FAQs
What layer count can you build?
Layer count depends on the complete design and is confirmed in engineering review.
Can you check my stack-up?
Yes. Send your proposed stack-up and targets for review.
