GaN is raising the performance ceiling for RF systems—but it is also raising the standard for the PCB around the device.

A recent industry analysis notes that GaN is gaining ground in 5G/6G, satellite, radar and other high-frequency applications because it can operate at higher voltages, temperatures and power densities. Moving from GaAs to GaN, however, is not a simple component substitution.

At ShinePCB, we help customers evaluate the board-level changes that follow.

Higher power density and frequency can affect laminate selection, copper construction, thermal paths, grounding, controlled impedance and RF launch geometry. These factors need to be considered together—not separated between a material datasheet, a PCB drawing and a later manufacturing review.

With 20 years of PCB industry experience, ShinePCB connects high-frequency material comparison with stack-up evaluation, manufacturability feedback, prototyping and production resources in China.

Our aim is to help engineering teams translate component performance into a PCB construction that can be manufactured consistently.

Developing a GaN-based RF, microwave or power electronics product? Bring the PCB and material requirements into the discussion early.

Originally published on ShinePCB’s LinkedIn company page: 2026-08-12.