Wi-Fi 7 is accelerating the next generation of smart devices — and PCB technology is becoming a key enabler.

Quectel has introduced new tri-band Wi-Fi 7 modules, including the FCE870X LCC module and FME170X M.2 module, featuring:
• 2.4 / 5 / 6 GHz Wi-Fi 7
• Bluetooth 6.0
• Zigbee & Thread connectivity

The modules are designed for applications such as AR/VR devices, smart gateways, conference terminals, projectors, and cloud-connected devices.

As 6 GHz wireless applications expand, PCB requirements are becoming more critical:
✓ Low-loss materials for high-frequency signal transmission
✓ Controlled impedance and RF trace optimization
✓ Stable stack-up and reference plane design
✓ EMI control and antenna integration
✓ HDI capability for compact products

At ShinePCB, we continue to support advanced electronic applications with high-frequency PCB materials, precision manufacturing, and engineering-driven solutions.

The evolution of Wi-Fi 7, AI edge devices, and smart terminals will create new demands for reliable PCB technologies.

Originally published on ShinePCB’s LinkedIn company page: 2026-08-05.