AI infrastructure is becoming an increasingly integrated electronics manufacturing business.

Luxshare Precision’s latest outlook points to continued growth across AI data-center infrastructure, alongside its broader communications and electronics businesses.

What is interesting is how much of the hardware stack is starting to come together.

Modern AI systems increasingly need:

• High-speed interconnect
• Optical connectivity
• Power management
• Thermal management
• Rack-level integration
• Reliable PCB assemblies

These are difficult to optimize independently.

A faster interconnect changes the PCB requirements.

Higher power density changes the thermal design.

More cooling and monitoring adds another layer of control electronics.

For hardware companies, the supply chain increasingly needs to connect material selection, PCB manufacturing, assembly and system requirements much earlier.

That is the sourcing approach we take at ShinePCB—connecting overseas hardware teams with the right materials, PCB processes and manufacturing resources across China’s electronics supply chain.

Originally published on ShinePCB’s LinkedIn company page: 2026-08-31.