AI data centers are starting to redesign the power architecture around the rack.
Flex has agreed to acquire EPC Power for $4.4 billion, adding software-defined power conversion and 800V data-center technology to its existing compute and liquid-cooling portfolio.
The scale of the transaction says something important.
Higher AI compute density is no longer only a server challenge.
It is becoming a power-engineering challenge.
Moving toward higher-voltage distribution puts more attention on:
• High-current PCB structures
• Creepage and clearance
• Low-inductance power paths
• Thermal management
• SiC and GaN power stages
• Monitoring and control electronics
A more efficient power semiconductor is only part of the solution.
The surrounding PCB still has to carry current, control heat and maintain reliability under continuous load.
At ShinePCB, we support power-electronics projects alongside high-speed PCB manufacturing, including multilayer, heavy-copper and thermal-management requirements.

Originally published on ShinePCB’s LinkedIn company page: 2026-09-04.