AI processors are getting harder to manufacture before they even reach the PCB.
ASML is working with leading chipmakers including Nvidia, Intel, TSMC and Samsung on future High-NA EUV technology designed to support larger advanced processors.
The semiconductor challenge is clear:
AI chips need both extremely small features and very large, complex compute architectures.
That pressure eventually reaches the board around the package.
Higher-performance processors typically bring more demanding requirements for:
• HBM and high-speed interfaces
• Package-to-board transitions
• High-current power delivery
• Low-loss PCB materials
• Controlled impedance
• Thermal management
• Manufacturing consistency
The chip and the PCB are built by very different processes.
But at the system level, their tolerances increasingly interact.
As compute performance rises, there is less room to treat PCB material, stack-up and fabrication as decisions that can be optimized independently.
At ShinePCB, we support high-speed PCB projects from material and stack-up review through fabrication and assembly.

Originally published on ShinePCB’s LinkedIn company page: 2026-09-08.